Test & Measurement Package Level Products

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Aetrium is a leading provider of reliability test and semiconductor handling solutions. Aetrium's gravity feed test handlers are ideally suited for high volume production handling of small devices using tube input and tube output media. Aetrium's reliability test system's massively parrallel architecture can run many tests, at many different temperatures at the same time. It can support package and wafer-level testing.


Cascade Microtech offers wafer prober stations for DC/CV, RF/Microwave and failure analysis applications. Complete line of probes for parametric, optical and RF/Microwave measurements including: probe cards, membrane probes, needle probes, air coplanar probes and lightwave probes. Integrated laser systems & micro-vibrometers.


Dage bondtesters boast maximum accuracy, repeatability, and reproductibility. Industry roadmap has promoted Dage to address lead-free concerns with the award winning 4000 HS platform. High Speed, also referred to as High Impact testing, has proven correlation with industry standard drop testing. The 4000-HS is the first to comply with recently published JEDEC standards for high-speed bondtesting.


Johnstech offers test sockets for RF, Microwave, Digital and Memory packages, LGA, BGA, SOIC. Characterization and production solutions for high density, high performance, low inductance, and low capacitance applications. New Yield Pro and Yield Pro Array Sockets.


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